| DC Field | Value | Language |
|---|
| dc.contributor.author | Waluyo Adi Siswanto | - |
| dc.contributor.author | Krasnopevtsev, A. Yu. | - |
| dc.contributor.author | Ghazal Feizi Talarpoushti | - |
| dc.contributor.author | Andino Maseleno | - |
| dc.contributor.author | Kuzichkin, O. R. | - |
| dc.date.accessioned | 2021-07-02T09:17:52Z | - |
| dc.date.available | 2021-07-02T09:17:52Z | - |
| dc.date.issued | 2020 | - |
| dc.identifier.citation | Role of alternating current shape on microstructure and damage evolution of solder joints / Waluyo Adi Siswanto [et al.] // Journal of Manufacturing Processes. - 2020. - Vol.50.-P. 450-455. - Doi: 10.1016/j.jmapro.2019.12.041. - Refer.: p. 454-455. | ru |
| dc.identifier.uri | http://dspace.bsu.edu.ru/handle/123456789/42728 | - |
| dc.description.abstract | Thermal resistivity of solder joints was considered as failure indicator and found that the triangle AC current had the significant effect on the increase of thermal resistivity in the solder joint in a certain time compared with other AC current shapes | ru |
| dc.language.iso | en | ru |
| dc.subject | physics | ru |
| dc.subject | electricity | ru |
| dc.subject | solder joint | ru |
| dc.subject | AC current | ru |
| dc.subject | degradation | ru |
| dc.subject | mechanical properties | ru |
| dc.subject | electric current | ru |
| dc.subject | electronic packages | ru |
| dc.title | Role of alternating current shape on microstructure and damage evolution of solder joints | ru |
| dc.type | Article | ru |
| Appears in Collections: | Статьи из периодических изданий и сборников (на иностранных языках) = Articles from periodicals and collections (in foreign languages)
|
