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Please use this identifier to cite or link to this item: http://dspace.bsu.edu.ru/handle/123456789/31310
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dc.contributor.authorChistyakov, E. M.-
dc.contributor.authorTerekhov, I. V.-
dc.contributor.authorShapagin, A. V.-
dc.contributor.authorFilatov, S. N.-
dc.contributor.authorChuev, V. P.-
dc.date.accessioned2020-06-02T18:31:18Z-
dc.date.available2020-06-02T18:31:18Z-
dc.date.issued2019-
dc.identifier.citationCuring of epoxy resin DER-331by Hexakis (4-acetamidophenoxy) cyclotriphosphazene and properties of the prepared composition / E.M. Chistyakov, I.V. Terekhov, A V. Shapagin [et al.] // Polymers. - 2019. - Vol.11, №7.-Art. 1191.ru
dc.identifier.urihttp://dspace.bsu.edu.ru/handle/123456789/31310-
dc.description.abstractThe method of optical wedge revealed that the optimum temperature for compatibility of hexakis(4-acetamidophenoxy)cyclotriphosphazene (ACP) and DER-331 epoxy resin is in the range of 220–260◦C. The interdiffusion time of components at these temperatures is about 30 min. The TGA and differential scanning calorimetry (DSC) methods revealed the curing temperature of 280◦C for thiscomposition. IRspectroscopyconfirmedthatthereactionbetweentheresinandACPiscompleted within 10 minru
dc.language.isoenru
dc.subjectchemistryru
dc.subjectpolymer chemistryru
dc.subjectphosphazenesru
dc.subjectepoxy resinru
dc.subjectthermostabilityru
dc.subjectamide cureru
dc.subjectcokeru
dc.titleCuring of epoxy resin DER-331by Hexakis (4-acetamidophenoxy) cyclotriphosphazene and properties of the prepared compositionru
dc.typeArticleru
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